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CM150DY 01726203 CSDA1DA 1012B M0410 ZMD20B UT54A 01922
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  c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 1 - n o v . , 2 0 1 2 a p l 3 5 2 0 a / b / c / d w w w . a n p e c . c o m . t w 1 a n p e c r e s e r v e s t h e r i g h t t o m a k e c h a n g e s t o i m p r o v e r e l i a b i l i t y o r m a n u f a c t u r a b i l i t y w i t h o u t n o t i c e , a n d a d v i s e c u s t o m e r s t o o b t a i n t h e l a t e s t v e r s i o n o f r e l e v a n t i n f o r m a t i o n t o v e r i f y b e f o r e p l a c i n g o r d e r s . u s b d u a l p o w e r - d i s t r i b u t i o n s w i t c h e s 70m w high side mosfet continuous current -apl3520a/b: 1.5a -apl3520c/d: 1a w i d e s u p p l y v o l t a g e r a n g e : 2 . 7 v t o 5 . 5 v current limit and short-circuit protections over-temperature protection deglitched fault indication output logic level enable input lead free and green devices available (rohs compliant) ul approved-file no. 20121029-e328191 nemko iec 60950-1 cb_scheme certified, no. no70693 tuv iec 60950-1 and en 60950-1 certified, no.44 780 12 406748-007 the apl3520 series of power switches are designed for usb applications. the 70m w n-channel mosfet power switch satisfies the voltage drop requirements of usb specification. the protection features include current-limit protection, short circuit protection, and over-temperature protection. the device limits the output current at current limit thresh- old level, and when v out drops below 1.5v, the devices limit the current to a lower and safe level. the otp limits the junction temperature below 140 o c in case of short circuit or over load conditions. other features include deglitched ocbx output to indi- cate the fault condition and enx input to turn on or turn off output. f e a t u r e s g e n e r a l d e s c r i p t i o n a p p l i c a t i o n s notebook and desktop computers usb ports high-side power protection switchs s i m p l i f i e d a p p l i c a t i o n c i r c u i t vin vout 1 gnd apl 3520 a / b / c / d ocb 1 vout 2 ocb 2 en 2 / enb 2 en 1 / enb 1 v out 1 v out 2 v in en control 1 en control 2
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 1 - n o v . , 2 0 1 2 a p l 3 5 2 0 a / b / c / d w w w . a n p e c . c o m . t w 2 p i n c o n f i g u r a t i o n s vin 2 7 vout 1 en 1 3 en 2 4 6 vout 2 5 ocb 2 8 ocb 1 gnd 1 sop - 8 apl 3520 a / c ( top view ) vin 2 7 vout 1 en 1 3 en 2 4 6 vout 2 5 ocb 2 8 ocb 1 gnd 1 msop - 8 apl 3520 a / c ( top view ) vin 2 7 vout 1 en 1 3 en 2 4 6 vout 2 5 ocb 2 8 ocb 1 gnd 1 msop - 8 p apl 3520 a / c ( top view ) vin 2 7 vout 1 enb 1 3 enb 2 4 6 vout 2 5 ocb 2 8 ocb 1 gnd 1 sop - 8 apl 3520 b / d ( top view ) vin 2 7 vout 1 enb 1 3 enb 2 4 6 vout 2 5 ocb 2 8 ocb 1 gnd 1 msop - 8 apl 3520 b / d ( top view ) vin 2 7 vout 1 enb 1 3 enb 2 4 6 vout 2 5 ocb 2 8 ocb 1 gnd 1 msop - 8 p apl 3520 b / d ( top view ) dfn 3 x 3 - 8 apl 3520 a / c vin 2 7 vout 1 en 1 3 en 2 4 6 vout 2 5 ocb 2 8 ocb 1 gnd 1 vin 2 7 vout 1 enb 1 3 enb 2 4 6 vout 2 5 ocb 2 8 ocb 1 gnd 1 dfn 3 x 3 - 8 apl 3520 b / d vin 2 7 vout 1 en 1 3 en 2 4 6 vout 2 5 ocb 2 8 ocb 1 gnd 1 tdfn 2 x 2 - 8 apl 3520 a / c ( top voew ) = exposed pad ( connected to ground plane for better heat dissipation ) vin 2 7 vout 1 enb 1 3 enb 2 4 6 vout 2 5 ocb 2 8 ocb 1 gnd 1 tdfn 2 x 2 - 8 apl 3520 b / d ( top voew )
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 1 - n o v . , 2 0 1 2 a p l 3 5 2 0 a / b / c / d w w w . a n p e c . c o m . t w 3 o r d e r i n g a n d m a r k i n g i n f o r m a t i o n n o t e : a n p e c l e a d - f r e e p r o d u c t s c o n t a i n m o l d i n g c o m p o u n d s / d i e a t t a c h m a t e r i a l s a n d 1 0 0 % m a t t e t i n p l a t e t e r m i n a t i o n f i n i s h ; w h i c h a r e f u l l y c o m p l i a n t w i t h r o h s . a n p e c l e a d - f r e e p r o d u c t s m e e t o r e x c e e d t h e l e a d - f r e e r e q u i r e m e n t s o f i p c / j e d e c j - s t d - 0 2 0 c f o r m s l c l a s s i f i c a t i o n a t l e a d - f r e e p e a k r e f l o w t e m p e r a t u r e . a n p e c d e f i n e s ? g r e e n ? t o m e a n l e a d - f r e e ( r o h s c o m p l i a n t ) a n d h a l o g e n f r e e ( b r o r c l d o e s n o t e x c e e d 9 0 0 p p m b y w e i g h t i n h o m o g e n e o u s m a t e r i a l a n d t o t a l o f b r a n d c l d o e s n o t e x c e e d 1 5 0 0 p p m b y w e i g h t ) . apl 3520 package code k : sop - 8 x : msop - 8 xa : msop - 8 p qb : tdfn 2 x 2 - 8 qa : dfn 3 x 3 - 8 operating ambient temperature range i : - 40 to 85 o c handling code tr : tape & reel output current / en function a : 1 . 5 a / active high b : 1 . 5 a / active low c : 1 a / active high d : 1 a / active low assembly material g : halogen and lead free device handling code temperature range package code apl 3520 a / b / c / d k : apl 3520 a xxxxx assembly material xxxxx - date code apl 3520 a / b / c / d qb : l 20 a x x - date code output current / en function apl 3520 a / b / c / d x : l 520 a xxx xx - date code apl 3520 b xxxxx l 520 b xxx xx xxx xx l 20 b x apl 3520 a / b / c / d x a : apl 3520 c xxxxx apl 3520 d xxxxx l 520 c xxx xx l 520 d xxx xx l 20 c x l 20 d x apl 3520 a / b / c / d q a : apl 3520 a xxxxx xxxxx - date code apl 3520 b xxxxx apl 3520 c xxxxx apl 3520 d xxxxx a b s o l u t e m a x i m u m r a t i n g s ( n o t e 1 ) symbol parameter rating unit v in vin input voltage (vi n to gnd ) - 0.3 ~ 5.7 v v out1 , v out2 vout1, vout2 to gnd voltage - 0.3 ~ 5.7 v v en1 , v en2 en1, en2 to gnd voltage (apl3520a/c) - 0.3 ~ 5.7 v v enb1 , v enb2 enb1, enb2 to gnd voltage (apl3520b/d) - 0.3 ~ 5 .7 v v ocb1 , v ocb2 ocb1, ocb2 to gnd voltage - 0.3 ~ 5.7 v t j maximum junction temperature 150 o c t stg storage temperature - 65 ~ 150 o c t sdr maximum lead soldering temperature , 10 seconds 26 0 o c hbm (human body mode) 2 kv esd immunity mm (machine m ode) 200 v note1: stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. these are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under "recom- mended operating conditions" is not implied. exposure to absolute maximum rating conditions for extended periods may affect device reliability.
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 1 - n o v . , 2 0 1 2 a p l 3 5 2 0 a / b / c / d w w w . a n p e c . c o m . t w 4 t h e r m a l c h a r a c t e r i s t i c s symbol parameter typical value unit q ja junction - to - ambient resistance in free air (note 2) sop - 8 msop - 8 msop - 8p tdfn2x2 - 8 dfn3x3 - 8 95 160 50 80 70 o c/w note 2 : q ja is measured with the component mounted on a high effective thermal conductivity test board in free air. symbol parameter range unit v in vin input voltage 2.7 ~ 5.5 v apl3520a/b 0 ~ 1.5 i out out output current (each port) apl3520c/d 0 ~ 1 a t a ambient temperature - 40 ~ 85 o c t j junction temperature - 40 ~ 125 o c r e c o m m e n d e d o p e r a t i n g c o n d i t i o n s ( n o t e 3 ) note 3 : refer to the typical application circuit
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 1 - n o v . , 2 0 1 2 a p l 3 5 2 0 a / b / c / d w w w . a n p e c . c o m . t w 5 e l e c t r i c a l c h a r a c t e r i s t i c s unless otherwise specified, these specifications apply over v in =5v, v en =5v or v enb =0v and t a = -40 ~ 85 o c. typical values are at t a =25 o c. apl3 52 0 symbol parameter test conditions min . typ . max . unit supply current no load, v en1 =v en2 =0v or v enb1 =v enb2 =5v - - 1 m a vin supply current no load, v en1 =v en2 =5v or v enb1 =v enb2 =0v - 90 - m a leakage current vout1=gnd, v en1 =0v or v enb1 =5v vout2=gnd, v en2 =0v or v enb2 =5v - - 1 m a reverse leakage current vin=gnd, v out1 =5v vin=gnd, v out2 =5v - 0 1 m a power switch1 & power switch2 i out =1a, t a = 2 5 o c - 70 - m w r ds(on) power switch on resistance i out =1a, t a = - 40 ~ 85 o c - 70 - m w under - vo ltage lockout (uvlo) vin uvlo threshold voltage v in rising, t a = - 40 ~ 85 o c 1.7 - 2.65 v vin uvlo hysteresis - 0.2 - v protections (current limit1/2 and short - circuit1/2) apl3520a/b - 3. 2 3.9 a i lim current limit threshold v in = 2.7 v to 5.5v, t a = - 40 ~ 85 o c apl3520c/d - 1.7 2.3 a apl3520a/b - 1.5 - a i short short - circuit output current v in = 2.7 v to 5.5v apl3520c/d - 0.8 - a fault indication output (ocb1 and ocb2) ocb output low voltage i ocb =5ma - 0.2 0.4 v ocb leakage current v ocb =5v - - 1 m a t d(ocb) ocb deglitch time ocb assertion, t a = - 40 ~ 85 o c 4 10 15 ms enable/disable (en1/enb1 and en2/enb2) v ih input logic high v in = 2.7 v to 5v 2 - - v v il input logic low v in = 2.7 v to 5v - - 0.8 v input current - - 1 m a vout discharge resistan ce v en =0v or v enb =5v, - 40 100 w t d(on) turn on delay time - 30 - m s t d(off) turn off delay time - 5 - m s t ss soft - start time no load, c out =1 m f, v in = 5 v - 400 - m s overt - temperature protection (otp1 & otp2) t otp over - temperature threshold t j rising - 140 - c over - temperature hysteresis - 20 - c
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 1 - n o v . , 2 0 1 2 a p l 3 5 2 0 a / b / c / d w w w . a n p e c . c o m . t w 6 p i n d e s c r i p t i o n pin no. name function 1 gnd ground . 2 vin power supply input. c onnect this pin to external dc supply. en1 (apl3520a/c) enable input. pulling this pin to high will enable the device and pulling this pin to low will disable device. the en1 pin ca nnot be left floating. 3 enb1 (apl3520b/d) enable input. pulling this pin to high will disable the device and pulling this pin to low will enable device. the enb1 pin cannot be left floating. en2 (apl3520a/c) enable input. pulling this pin to high will enable the device and pulling this pin to low will disable device. the en2 pin cannot be left floating. 4 enb2 (apl3520b/d) enable input. pulling this pin to high will disable the device and pulling this pin to low will enable device. the enb2 pin cannot be left floating. 5 ocb2 fault indication pin. this pin goes low when a current limit or an over - temperature condition is detected in vout2 after a 10ms deglitch time. 6 vout2 output voltage pin. the output voltage follows the input voltage. when enb2 i s high or en2 is low the output voltage is discharged by an internal resistor. 7 vout1 output voltage pin. the output voltage follows the input voltage. when enb1 is high or en1 is low the output voltage is discharged by an internal resistor. 8 ocb1 faul t indication pin. this pin goes low when a current limit or an over - temperature condition is detected in vout1 after a 10ms deglitch time. - ep exposed pad. connect it to a large ground plane for heat sinking. (tdfn2x2 - 8, msop - 8p)
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 1 - n o v . , 2 0 1 2 a p l 3 5 2 0 a / b / c / d w w w . a n p e c . c o m . t w 7 t y p i c a l o p e r a t i n g c h a r a c t e r i s t i c s s w i t c h o n r e s i s t a n c e , r d s ( o n ) ( m [ ) switch on resistance vs . junction temperature 40 60 80 100 120 20 0 o c - 50 0 50 100 150 ) junction temperature ( v in = 5 v , r load = 47 [ , c in = 1 uf / x 7 r , c out = 10 m f / x 7 r , switch on resistance vs . input voltage 60 80 90 100 110 120 130 70 50 s w i t c h o n r e s i s t a n c e , r d s ( o n ) ( m [ ) input voltage ( v ) 2 . 5 3 . 0 3 . 5 4 . 0 4 . 5 5 . 0 5 . 5 r load = 47 [ , c in = 1 uf / x 7 r , c out = 10 m f / x 7 r , t a = 25 o c supply current vs . junction temperature s u p p l y c u r r e n t , i c c ( u a ) 80 85 90 95 100 o c - 50 0 50 100 150 ) junction temperature ( v in = v en 1 = v en 2 = 5 v , r load = open , c in = c out = 33 m f / electrolytic 60 65 70 75 supply current vs . input voltage input voltage ( v ) 2 . 5 3 . 0 3 . 5 4 . 0 4 . 5 5 . 0 5 . 5 s u p p l y c u r r e n t , i c c ( u a ) v en 1 = v en 2 = 5 v , r load = open , c in = c outx = 33 m f / electrolytic , t a = 25 j 65 70 75 80 85 90 95 100 60 o c - 50 0 50 100 150 ) junction temperature ( switch off supply current vs . junction temperature s w i t c h o f f s u p p l y c u r r e n t , i c c ( o f f ) ( u a ) 4 5 6 7 10 0 1 2 3 v in = 5 v , r load = open , c in = c out = 33 m f / elctrolytic 8 9 input voltage ( v ) 2 . 5 3 . 0 3 . 5 4 . 0 4 . 5 5 . 0 5 . 5 current limit threshold vs . input voltage t a = 25 o c c u r r e n t l i m i t t h r e s h o l d , i l i m ( a ) 2 . 0 2 . 5 3 . 0 3 . 5 4 . 0 4 . 5
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 1 - n o v . , 2 0 1 2 a p l 3 5 2 0 a / b / c / d w w w . a n p e c . c o m . t w 8 t y p i c a l o p e r a t i n g c h a r a c t e r i s t i c s 0 50 100 150 200 250 300 0 2 4 6 8 10 output peak current ( a ) c u r r e n t - l i m i t r e s p o n s e ( m s ) current - limit response vs . output peak current apl 3520 a , v in = 5 v , t a = 25 o c o c - 50 0 50 100 150 ) junction temperature ( c u r r e n t l i m i t t h r e s h o l d , i l i m ( a ) 2 . 0 2 . 5 3 . 0 3 . 5 4 . 0 4 . 5 5 . 0 current limit threshold vs . junction temperature short - circuit output current vs . input voltage input voltage ( v ) 2 . 5 3 . 0 3 . 5 4 . 0 4 . 5 5 . 0 5 . 5 1 . 0 1 . 1 1 . 2 1 . 3 1 . 4 1 . 5 1 . 6 s h o r t - c i r c u i t o u t p u t c u r r e n t , i s h o r t ( a ) t a = 25 o c en pin threshold voltage vs . junction temperature e n p i n t h r e s h o l d v o l t a g e , v e n ( v ) 0 . 5 1 . 0 1 . 5 2 . 0 2 . 5 3 . 0 o c - 50 0 50 100 150 ) junction temperature ( en rising en falling v in = 5 v , r load = 50 [ , c in = c out = 33 m f / elctrolytic en pin threshold voltage vs . input voltage input voltage ( v ) 2 . 5 3 . 0 3 . 5 4 . 0 4 . 5 5 . 0 5 . 5 e n p i n t h r e s h o l d v o l t a g e , v e n ( v ) 1 . 3 1 . 4 1 . 5 1 . 6 1 . 7 1 . 8 1 . 9 2 . 0 2 . 1 0 . 8 0 . 9 1 . 0 1 . 1 1 . 2 r load = 50 [ , c in = c out = 33 m f / elctrolytic , t a = 25 o c en rising en falling turn - off leakage current vs . junction temperature t u r n - o f f l e a k a g e c u r r e n t , i l e a k ( u a ) o c - 50 0 50 100 150 ) junction temperature ( 0 . 0 0 . 5 1 . 0 1 . 5 2 . 0 2 . 5 3 . 0 3 . 5 4 . 0 v in = 5 v , r load = 0 [ , c in = c out = 33 m f / elctrolytic
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 1 - n o v . , 2 0 1 2 a p l 3 5 2 0 a / b / c / d w w w . a n p e c . c o m . t w 9 t y p i c a l o p e r a t i n g c h a r a c t e r i s t i c s ocb deglitch time vs . junction temperature o c b d e g l i t c h t i m e , t d ( o c b ) ( m s ) 8 9 10 11 12 13 14 15 7 o c - 50 0 50 100 150 ) junction temperature ( r load = 1 [ , c in = c out = 33 m f / elctrolytic ocb deglitch time vs . input voltage input voltage ( v ) 2 . 5 3 . 0 3 . 5 4 . 0 4 . 5 5 . 0 5 . 5 o c b d e g l i t c h t i m e , t d ( o c b ) ( m s ) 8 9 10 11 12 13 14 15 r load = 1 [ , c in = c out = 33 m f / elctrolytic 7 uvlo threshold voltage vs . junction temperature u v l o t h r e s h o l d v o l t a g e , v v l o c ( v ) 1 . 2 1 . 6 2 . 0 2 . 4 2 . 8 3 . 2 uvlo rising uvlo falling 0 . 8 v in increasing , r load = 15 m [ , c in = c out = 33 m f / elctrolytic o c - 50 0 50 100 150 ) junction temperature ( output voltage vs . output current 0 . 0 0 . 5 1 . 0 1 . 5 2 . 0 2 . 5 3 . 0 0 1 2 3 4 5 6 o u t p u t v o l t a g e , v o u t ( v ) output current ( a ) 3 . 5 apl 3520 a , v in = 5 v , t a = 25 j t u r n - o n r i s i n g t i m e , t r ( u s ) 0 50 100 300 350 turn - on rising time vs . junction temperature 150 200 250 o c - 50 0 50 100 150 ) junction temperature ( v in = 5 v , r load = 30 [ , v out 10 % ~ 90 % c in = 33 m f / elctrolytic , c out = 1 m f / x 7 r output voltage vs . output current o u t p u t v o l t a g e , v o u t ( v ) output current ( a ) 0 . 0 0 . 5 1 . 0 1 . 5 2 . 0 2 . 5 3 . 0 0 1 2 3 4 5 6 3 . 5 apl 3520 c , v in = 5 v , t a = 25 j
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 1 - n o v . , 2 0 1 2 a p l 3 5 2 0 a / b / c / d w w w . a n p e c . c o m . t w 1 0 o p e r a t i n g w a v e f o r m s t h e t e s t c o n d i t i o n i s v i n = 5 v , t a = 2 5 o c u n l e s s o t h e r w i s e s p e c i f i e d . turn on response 1 2 v en 1 ch 1 : v en 1 , 5 v / div , dc time : 200 u s / div v in = 5 v , r load = 30 [ , c in = 33 uf / electrolytic , c out = 1 m f / electrolytic , v out 1 ch 2 : v en 2 , 5 v / div , dc v en 2 v out 2 ch 3 : v out 1 , 2 v / div , dc ch 4 : v out 2 , 2 v / div , dc 3 4 turn off response 1 v in = 5 v , r load = 30 [ , c in = 33 uf / electrolytic , c out = 1 m f / electrolytic , 2 3 4 v en 1 v out 1 v en 2 v out 2 ch 1 : v en 1 , 5 v / div , dc time : 200 u s / div ch 2 : v en 2 , 5 v / div , dc ch 3 : v out 1 , 2 v / div , dc ch 4 : v out 2 , 2 v / div , dc time : 5 m s / div uvlo at rising v out 1 v in 1 3 2 v in = 5 v , r load = 30 [ , en 1 and en 2 tied to vin , c in = 33 uf / electrolytic , cout = 1m f / electrolytic , ch 1 : v in , 2 v / div , dc ch 2 : v out 1 , 2 v / div , dc v out 2 ch 3 : v out 2 , 2 v / div , dc uvlo at falling v in 1 2 v out 1 time : 5 m s / div ch 2 : v out 1 , 1 v / div , dc v in = 5 v , r load = 30 [ , en 1 and en 2 tied to vin , c in = 33 uf / electrolytic , c out = 1 m f / electrolytic , ch 1 : v in , 2 v / div , dc 3 v out 2 ch 3 : v out 2 , 1 v / div , dc
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 1 - n o v . , 2 0 1 2 a p l 3 5 2 0 a / b / c / d w w w . a n p e c . c o m . t w 1 1 o p e r a t i n g w a v e f o r m s t h e t e s t c o n d i t i o n i s v i n = 5 v , t a = 2 5 o c u n l e s s o t h e r w i s e s p e c i f i e d . ocb response during short circuit v ocbx v outx 1 2 ch 1 : v ocbx , 5 v / div , ac ch 2 : v outx , 2 v / div , dc time : 2 ms / div i outx 3 v in = 5 v , voutx switched into ground , c in = c out = 33 uf / electrolytic ch 3 : i outx , 5 a / div , dc ocb response with ramped load 1 2 ch 1 : v ocbx , 5 v / div , ac ch 2 : v outx , 2 v / div , dc time : 2 ms / div v in = 5 v , c in = c out = 33 uf / electrolytic ch 3 : i out , 5 a / div , dc v ocbx v outx i outx 3 load - transient 2 1 i out v out ch 1 : v in , 2 v / div , dc time : 20 m s / div v in = 5 v , i out = 0 to 2 a , c in = c out = 33 uf / electrolytic ch 3 : i out , 2 a / div , dc 3 v in v outx i outx ch 2 : v outx , 1 v / div , dc ocb response during over load 1 2 ch 1 : v ocbx , 5 v / div , ac ch 2 : v outx , 2 v / div , dc time : 2 ms / div v in = 5 v , r load = 1 [ touches voutx , c in = c out = 33 uf / electrolytic ch 3 : i outx , 2 a / div , dc 3 v ocbx v outx i outx
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 1 - n o v . , 2 0 1 2 a p l 3 5 2 0 a / b / c / d w w w . a n p e c . c o m . t w 1 2 b l o c k d i a g r a m vin vout1 ocb1 en1/ enb1 gnd gate driver and control logic1 uvlo charge pump1 otp1 current limit1 short-circuit protection 1 gate driver and control logic2 charge pump2 otp2 current limit2 short-circuit protection2 en2/ enb2 vout2 ocb2
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 1 - n o v . , 2 0 1 2 a p l 3 5 2 0 a / b / c / d w w w . a n p e c . c o m . t w 1 3 t y p i c a l a p p l i c a t i o n c i r c u i t vin vout 1 gnd apl 3520 a / b / c / d ocb 1 en 1 / enb 1 usb controller 5 v 3 . 3 v c in 1 m f vout 2 v bus d + d - gnd usb port 1 c out 1 150 m f v bus d + d - gnd c out 2 150 m f usb port 2 ocb 2 en 2 / enb 2 50 k w 50 k w 0 . 1 m f 0 . 1 m f
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 1 - n o v . , 2 0 1 2 a p l 3 5 2 0 a / b / c / d w w w . a n p e c . c o m . t w 1 4 f u n c t i o n d e s c r i p t i o n vin under-voltage lockout (uvlo) the apl3520 series of power switches have a built-in under-voltage lockout circuit to keep the output shutting off and discharging through an internal resistor until in- ternal circuitry is operating properly. the uvlo circuit has hysteresis and a de-glitch feature so that it will typically ignore undershoot transients on the input. when input voltage exceeds the uvlo threshold, the output voltage starts a soft-start to reduce the inrush current. power switch the power switches are n-channel mosfets with low r ds(on) . the internal power mosfets do not have the body diode. when ic is off, the mosfets prevent current flow- ing from the voutx back to vin and vin to voutx. current-limit protection the apl3520 series of power switches provide the cur- rent-limit protection function. during current limit, the de- vices limit output current at current limit threshold. for reliable operation, the device should not be operated in current limit for extended period. short-circuit protection when the output voltage drops below 1.5 v, which is caused by an over-load or a short-circuit, the devices limit the output current down to a safe level. the short-circuit current limit is used to reduce the power dissipation dur- ing short-circuit conditions. if the junction temperature reaches over-temperature threshold, the device will en- ter the thermal shutdown. ocb output the apl3520 series of power switches provide an open- drain output to indicate that a fault has occurred. when any of current limit or over-temperature protection occurs for a deglitch time of t d(ocb) , the ocb1/ocb2 goes low. since the ocb1/ocb2 pin is an open-drain output, con- necting a resistor to a pull high voltage is necessary. enable/disable pull the enb1/enb2 above 2v or en1/en2 below 0.8v will disable the device, and pull enb1/enb2 pin below 0.8v or en1/en2 above 2v will enable the device. when the ic is disabled, the supply current is reduced to less over-temperature protection when the junction temperature exceeds 140 o c, the inter- nal thermal sense circuit turns off the power fet and allows the device to cool down. when the device?s junc- tion temperature cools by 20 o c, the internal thermal sense circuit will enable the device, resulting in a pulsed output during continuous thermal protection. thermal protection is designed to protect the ic in the event of over temperature conditions. for normal operation, the junction temperature cannot exceed t j =+125 o c. than 1 m a. the enable input is compatible with both ttl and cmos logic levels. the en1/en2 or enb1/enb2 pin cannot be left floating.
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 1 - n o v . , 2 0 1 2 a p l 3 5 2 0 a / b / c / d w w w . a n p e c . c o m . t w 1 5 a p p l i c a t i o n i n f o r m a t i o n ( c o n t . ) recommended minimum footprint 5 . 385 1 . 83 1 . 2 7 0 . 5 unit : mm sop - 8 0 . 305 0 . 66 0 . 305 0 . 61 dfn 3 x 3 - 8 1 . 575 2 . 1 4 6 unit : mm 0 . 305 0 . 66 0 . 28 1 . 537 msop - 8 p 2 . 49 2 . 4 9 unit : mm 0 . 305 0 . 66 1 . 537 msop - 8 4 . 585 unit : mm 0 . 50 0 . 24 0 . 57 0 . 23 tdfn 2 x 2 - 8 1 . 3 0 . 8 unit : mm
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 1 - n o v . , 2 0 1 2 a p l 3 5 2 0 a / b / c / d w w w . a n p e c . c o m . t w 1 6 p a c k a g e i n f o r m a t i o n s o p - 8 s y m b o l min. max. 1.75 0.10 0.17 0.25 0.25 a a1 c d e e1 e h l millimeters b 0.31 0.51 sop-8 0.25 0.50 0.40 1.27 min. max. inches 0.069 0.004 0.012 0.020 0.007 0.010 0.010 0.020 0.016 0.050 0 0.010 1.27 bsc 0.050 bsc a2 1.25 0.049 0 8 0 8 d e e e 1 see view a c b h x 4 5 a a 1 a 2 l view a 0 . 2 5 seating plane gauge plane note: 1. follow jedec ms-012 aa. 2. dimension ? d ? does not include mold flash, protrusions or gate burrs. mold flash, protrusion or gate burrs shall not exceed 6 mil per side. 3. dimension ? e ? does not include inter-lead flash or protrusions. inter-lead flash and protrusions shall not exceed 10 mil per side. 3.80 5.80 4.80 4.00 6.20 5.00 0.189 0.197 0.228 0.244 0.150 0.157
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 1 - n o v . , 2 0 1 2 a p l 3 5 2 0 a / b / c / d w w w . a n p e c . c o m . t w 1 7 p a c k a g e i n f o r m a t i o n m s o p - 8 a 0 l view a 0 . 2 5 gauge plane seating plane a 1 d e see view a e 1 e a 2 b c s y m b o l min. max. 1.10 0.00 0.22 0.38 0.08 0.23 0.15 a a1 b c d e e1 e l millimeters a2 0.75 0.95 0.65 bsc msop-8 0.40 0.80 0.026 bsc min. max. inches 0.043 0.000 0.030 0.037 0.009 0.015 0.003 0.009 0.016 0.031 0 0.006 0 8 0 8 4.70 5.10 2.90 3.10 2.90 3.10 0.114 0.122 0.185 0.201 0.114 0.122 note: 1. follow jedec mo-187 aa. 2. dimension ? d ? does not include mold flash, protrusions or gate burrs. mold flash, protrusion or gate burrs shall not exceed 6 mil per side. 3. dimension ? e1 ? does not include inter-lead flash or protrusions. inter-lead flash and protrusions shall not exceed 5 mil per side.
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 1 - n o v . , 2 0 1 2 a p l 3 5 2 0 a / b / c / d w w w . a n p e c . c o m . t w 1 8 p a c k a g e i n f o r m a t i o n m s o p - 8 p a 0 l view a 0 . 2 5 seating plane gauge plane a 1 d e see view a e 1 e a 2 b c d1 e 2 exposed pad s y m b o l min. max. 1.10 0.00 0.22 0.38 0.08 0.23 0.15 a a1 b c d e e1 e l millimeters a2 0.75 0.95 0.65 bsc msop-8p 0.40 0.80 0.026 bsc min. max. inches 0.043 0.000 0.030 0.037 0.009 0.015 0.003 0.009 0.016 0.031 0 0.006 d1 e2 1.50 2.50 0.059 0.098 1.50 2.50 0.059 0.098 0 8 0 8 2.90 3.10 2.90 3.10 4.70 5.10 0.114 0.122 0.185 0.201 0.114 0.122 note: 1. follow jedec mo-187 aa-t 2. dimension ? d ? does not include mold flash, protrusions or gate burrs. mold flash, protrusion or gate burrs shall not flash or protrusions. 3. dimension ? e1 ? does not include inter-lead flash or protrusions. inter-lead flash and protrusions shall not exceed 6 mil per side.
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 1 - n o v . , 2 0 1 2 a p l 3 5 2 0 a / b / c / d w w w . a n p e c . c o m . t w 1 9 t d f n 2 x 2 - 8 s y m b o l min. max. 0.80 0.00 0.18 0.30 1.00 1.60 0.05 0.60 a a1 b d d2 e e2 e l millimeters a3 0.20 ref tdfn2x2-8 0.30 0.45 1.00 0.008 ref min. max. inches 0.031 0.000 0.007 0.012 0.039 0.063 0.024 0.012 0.018 0.70 0.039 0.028 0.002 0.50 bsc 0.020 bsc 1.90 2.10 0.075 0.083 1.90 2.10 0.075 0.083 note : 1. followed from jedec mo-229 wccd-3. e l e 2 pin 1 cornar d2 e d a b a1 a3 p a c k a g e i n f o r m a t i o n
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 1 - n o v . , 2 0 1 2 a p l 3 5 2 0 a / b / c / d w w w . a n p e c . c o m . t w 2 0 p a c k a g e i n f o r m a t i o n dfn3x3-8 s y m b o l min. max. 1.00 0.00 0.25 0.35 1.90 2.40 0.05 1.40 a a1 b d d2 e e2 e l millimeters a3 0.20 ref dfn3x3-8 0.30 0.50 1.75 0.008 ref min. max. inches 0.039 0.000 0.010 0.014 0.075 0.094 0.055 0.012 0.020 0.80 0.069 0.031 0.002 0.65 bsc 0.026 bsc 0.20 0.008 k 2.90 3.10 0.114 0.122 2.90 3.10 0.114 0.122 d e pin 1 a a1 a3 b d2 pin 1 corner e e 2 k l
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 1 - n o v . , 2 0 1 2 a p l 3 5 2 0 a / b / c / d w w w . a n p e c . c o m . t w 2 1 c a r r i e r t a p e & r e e l d i m e n s i o n s a e 1 a b w f t p0 od0 b a0 p2 k0 b 0 section b-b section a-a od1 p1 h t1 a d application a h t1 c d d w e1 f 330.0 ? 2.00 50 min. 12.4+2.00 - 0.00 13.0+0.50 - 0.20 1.5 min. 20.2 min. 12.0 ? 0.30 1.75 ? 0.10 5.5 ? 0.05 p 0 p1 p 2 d 0 d1 t a 0 b 0 k 0 sop - 8 4.0 ? 0.10 8.0 ? 0.10 2.0 ? 0.05 1.5+0.10 - 0.00 1.5 min. 0.6+0.00 - 0.40 6.40 ? 0.20 5.20 ? 0.20 2.10 ? 0.20 a h t1 c d d w e1 f 330.0 ? 2.00 50 min. 12.4+2.00 - 0.00 13.0+0.50 - 0.20 1.5 min. 20.2 min. 12.0 ? 0.30 1.75 ? 0.10 5.5 ? 0.05 p 0 p1 p 2 d 0 d1 t a 0 b 0 k 0 msop - 8(p) 4.00 ? 0.10 8.00 ? 0.10 2.00 ? 0.05 1.5+0.10 - 0.00 1.5 min. 0.6+0.00 - 0.40 5.30 ? 0.20 3.30 ? 0.20 1.40 ? 0.20 a h t1 c d d w e1 f 178.0 ? 2.00 50 min. 8.4+2.00 - 0.00 13.0+0.50 - 0.20 1.5 min. 20.2 min. 8.0 ? 0.20 1.75 ? 0.10 3.50 ? 0.05 p 0 p1 p 2 d 0 d1 t a 0 b 0 k 0 tdfn2x2 - 8 4.0 ? 0.10 4.0 ? 0.10 2.0 ? 0.05 1.5+0 .10 - 0.00 1.5 min. 0.6+0.00 - 0.4 2.35 ? 0.20 2.35 ? 0.20 1.30 ? 0.20 a h t1 c d d w e1 f 178.0 ? 2.00 50 min. 12.4+2.00 - 0.00 13.0+0.50 - 0.20 1.5 min. 20.2 min. 12.0 ? 0.30 1.75 ? 0.10 5.5 ? 0.05 p 0 p1 p 2 d 0 d1 t a 0 b 0 k 0 dfn3x3 - 8 4.0 ? 0.10 8.0 ? 0.10 2.0 ? 0.05 1.5+0.10 - 0.00 1.5 min. 0.6+0.00 - 0.40 3.30 ? 0.20 3.30 ? 0.20 1.30 ? 0.20 (mm)
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 1 - n o v . , 2 0 1 2 a p l 3 5 2 0 a / b / c / d w w w . a n p e c . c o m . t w 2 2 t a p i n g d i r e c t i o n i n f o r m a t i o n s o p - 8 m s o p - 8 ( p ) d e v i c e s p e r u n i t package type unit quantity sop - 8 tape & reel 2500 msop - 8(p) tape & reel 3000 tdfn2x2 - 8 tape & reel 3000 dfn3x3 - 8 tape & reel 3000 user direction of feed user direction of feed
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 1 - n o v . , 2 0 1 2 a p l 3 5 2 0 a / b / c / d w w w . a n p e c . c o m . t w 2 3 t a p i n g d i r e c t i o n i n f o r m a t i o n ( c o n t . ) t d f n 2 x 2 - 8 user direction of feed dfn3x3-8 user direction of feed
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 1 - n o v . , 2 0 1 2 a p l 3 5 2 0 a / b / c / d w w w . a n p e c . c o m . t w 2 4 c l a s s i f i c a t i o n p r o f i l e
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 1 - n o v . , 2 0 1 2 a p l 3 5 2 0 a / b / c / d w w w . a n p e c . c o m . t w 2 5 c l a s s i f i c a t i o n r e f l o w p r o f i l e s profile feature sn - pb eutectic assembly pb - free assembly preheat & soak temperature min (t smin ) temperature max (t smax ) time (t smin to t smax ) ( t s ) 100 c 150 c 60 - 120 seconds 150 c 200 c 60 - 1 2 0 seconds average ramp - up rate (t smax to t p ) 3 c/second ma x. 3 c/second max. liquidous temperature ( t l ) time at l iquidous (t l ) 183 c 60 - 150 seconds 217 c 60 - 150 seconds peak package body temperature (t p ) * see classification temp in table 1 see classification temp in table 2 time (t p ) ** within 5 c of the spec ified c lassification t emperature ( t c ) 2 0 ** seconds 3 0 ** seconds average r amp - down rate (t p to t smax ) 6 c/second max. 6 c/second max. time 25 c to p eak t emperature 6 minutes max. 8 minutes max. * tolerance for peak profile temperature (t p ) is defined a s a supplier minimum and a user maximum. ** tolerance for time at peak profile temperature (t p ) is defined as a supplier minimum and a user maximum. table 2. pb - free process ? classification temperatures (tc) package thickness volume mm 3 <350 volume mm 3 350 - 2000 volume mm 3 >2000 <1.6 mm 260 c 260 c 260 c 1.6 mm ? 2.5 mm 260 c 250 c 245 c 3 2.5 mm 250 c 245 c 245 c table 1. snpb eutectic process ? classification temperatures (tc) package thickness volume mm 3 <350 volume mm 3 3 350 <2.5 mm 235 c 22 0 c 3 2.5 mm 220 c 220 c test item method description solderability jesd - 22, b102 5 sec, 245 c holt jesd - 22, a108 1000 hrs, bias @ tj=125 c pct jesd - 22, a102 168 hrs, 100 % rh, 2atm , 121 c tct jesd - 22, a104 500 cycles, - 65 c~150 c hbm mil - std - 883 - 3015.7 vhbm ? 2kv mm jesd - 22, a1 15 vmm ? 200v latch - up jesd 78 10ms, 1 tr ? 100ma r e l i a b i l i t y t e s t p r o g r a m
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 1 - n o v . , 2 0 1 2 a p l 3 5 2 0 a / b / c / d w w w . a n p e c . c o m . t w 2 6 c u s t o m e r s e r v i c e a n p e c e l e c t r o n i c s c o r p . head office : no.6, dusing 1st road, sbip, hsin-chu, taiwan, r.o.c. tel : 886-3-5642000 fax : 886-3-5642050 t a i p e i b r a n c h : 2 f , n o . 1 1 , l a n e 2 1 8 , s e c 2 j h o n g s i n g r d . , s i n d i a n c i t y , t a i p e i c o u n t y 2 3 1 4 6 , t a i w a n t e l : 8 8 6 - 2 - 2 9 1 0 - 3 8 3 8 f a x : 8 8 6 - 2 - 2 9 1 7 - 3 8 3 8


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